Physical Vapor Deposition
© E308-01
Sputtering system
DC/RF Magnetron Sputtering System
UHV vacuum system
Single 3 cathode configuration
Plasma generator MKS ENI RPG 10
Substrate heating up to 700 °C
© E308-01
Lab-scale HiPIMS system
designed by Stefan Rißlegger
Lab-scale HiPIMS System with Focus on the deposition of TM-carbides
In house developed UHV System
Single 3'' cathode configuration
Acetylene (C2H2) process gas
DC, MF, RF and HiPIMS sputtering
Melec SIPP pulse generator
- Powered by 3x ADL DC generator 3 kW
- Capable of superimposed DC + HiPIMS signal
- DC or synchronised bias potential
Substrate heating up to 650 °C
© E308-01
DC/RF Magnetron sputtering systems
DC/RF Magnetron Sputtering System
UHV vacuum system
Confocal arrangement of 3 cathodes (1x3'', 2x2'')
Plasma generator MKS ENI RPG 10
Substrate heating up to 700 °C
© E308-01
Ultra high vacuum system developed in-house
Designed by Philipp Ertelthaler
semi industrial HiPIMS deposition system
in house developed UHV vacuum system
multi cathode configuration
- 2x6''
- 2x3''
DC, RF and HiPIMS sputtering
Solvix HiP3 5 kW plasma generators
Substrate heating up to 600 °C
Load-lock transfer system with ability for fully automated deposition runs
© Dagmar Fischer
Image of the Innova industrial arc evaporation and sputtering system
Industrial arc evaporation and sputtering system
Equipped with 6 arc sources and 4 sputter sources
Versatile magnetic systems
Balzers central arc etching technology
Deposition temperatures up to 600 °C
Industry 4.0 target material storage system
Capacity for over 2000 6'' targets in Balzers geometry