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Hot Lithography printer

Hot Lithography printer

Producing three-dimensional centimeter-scale structures with sub-micron features out of a photosensitive resin can be done a in a reasonable time. Multi-Photon Lithography (MPL) makes it possible to print within a solid or viscous material, be it a hybrid organic-inorganic resin or a cell-laden hydrogel: in contrast to other lithography-based and 3D-printing processes it is not necessary to build a part by stacking up individual layers. Using this new technique, the benefits of real 3D-structuring can be used, even within a microchannel.
Technical specifications for the MPL structuring device based on a tunable (700-1000nm) femto-second Laser and a Galvanoscanner:
Build envelope 50x50x40mm.
Minimum resolution in XY-plane: 200nm
Minimum resolution in z-plane: 700nm
Maximum scanning speed: 600 mm/s  
Manufacturer: TU-Wien, AMT

Producing three-dimensional centimeter-scale structures with sub-micron features out of a photosensitive resin can be done a in a reasonable time. Multi-Photon Lithography (MPL) makes it possible to print within a solid or viscous material, be it a hybrid organic-inorganic resin or a cell-laden hydrogel: in contrast to other lithography-based and 3D-printing processes it is not necessary to build a part by stacking up individual layers. Using this new technique, the benefits of real 3D-structuring can be used, even within a microchannel.

Technical specifications for the MPL structuring device based on a tunable (700-1000nm) femto-second Laser and a Galvanoscanner:
Build envelope 50x50x40mm.
Minimum resolution in XY-plane: 200nm
Minimum resolution in z-plane: 700nm
Maximum scanning speed: 600 mm/s  
Manufacturer: TU-Wien, AMT

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Hybrid AM: Combination of lithography-based AM with inkjet processes

Hybrid AM: Combination of lithography-based AM with inkjet processes

As the name suggests, the system provides a hybrid approach, combining lithography based AM with inkjet processes. It includes two different industrial inkjet systems which were implemented to increase the functionality and print multi material parts.
The building platform can rotate between a SLA-station (DLP-based exposure in a vat containing photopolymer) and an inkjet station, where an inkjet printhead selectively places ink droplets in between the cured layers (see figure).
The system has a circular vat and can be heated up to 80 °C. Filled and unfilled, viscous slurries and resins can be processed. The printer is located in the Lehartrakt laboratory at Getreidemarkt.

Technical specification SLA

• Build envelope: 70x40x120 mm (x y z)
• Lateral accuracy: 50 µm
• Layer thickness: 20 to 100 µm
• DLP Light Engine: 365 nm

Technical specification Inkjet

• Resolution: 360 dpi, 48 µm nozzle size
• Ink viscosity: 10 – 20 mPas
• Ink surface tension: 30 mN/m
• Ink supply: recirculating

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Blueprinter 8

Blueprinter 8

Blueprinter 8 (BO8) is a hybrid system with an exposure configuration. A projected mask is combined with a vector-based laser system via a dichroic beam-splitter. A Digital Light Processing (DLP®) Light Engine (LE) facilitates the mask-projection unit, whereas a 2D laser-scanner hatches a focused laser throughout the image plane. The goal is to combine the benefits of both exposure units. The DLP® LE projects a rather coarse (pixel size 56 μm) image onto the image plane. This allows us to rapidly generate a desired cross-section (layer). In contrast to this exposure approach, a laser allows a smooth surface since the laser is guided continuously by the scanner and shapes the contours with a continuous laser exposed line. The dual exposure combines both units, whereby just the contour is formed out by the laser and the remaining area is exposed by the DLP® LE. (Detailed information: B. Busetti et al.; A hybrid exposure concept for lithography-based additive manufacturing, Additive Manufacturing, 21, 2018)

Technical specification

• Build envelope 140 x 90 x 155 mm (x y z)
• Layer thickness: 25 to 100 µm
• Laser diode module: 405 nm, 166 mW
• Spot diameter: 20 µm
• DLP engine: 450 nm, 20 mW/cm²  
• DLP pixel size: 56µm