E138-03 ../ Functional Materials

Research

Growth of Polycrystalline Films

How are the nucleation conditions and the final structure of polycrystalline coatings connected and is it possible to quantify these relations?
The images below show a simulation of grain growth in polycrystalline films.

Color picture - simulation of grain growth in polycrystalline films

© IFP

Condensation and Wetting

Are classic thermodynamic statements also valid for the condensation from the vapor phase?
The following images show the development of a wetting layer of Sn on an Al-surface in Ultra High Vacuum (UHV) despite the thermodynamic immiscibility of Al and Sn.

Development of a wetting layer of Sn on an Al-surface in Ultra High Vacuum (UHV) despite the thermodynamic immiscibility of Al and Sn

© IFP

Heterogenous Films

How can the phase-distribution in multi-component films be described?
The images show the development of a connected phase (green, "percolation phase") of the minority phase in a two-component film.

Development of a connected phase (green, "percolation phase") of the minority phase in a two-component film

© IFP

Plasma-treatment of Surfaces and Adhesion

How can surface properties be modified by plasma treatment?
The image series shows the on-going roughening of a Lead-Bronze surface by Ar-DC-plasma with increasing exposure time.

On-going roughening of a Lead-Bronze surface by Ar-DC-plasma with increasing exposure time

© IFP

Temperature-treatment and De-wetting

How does a coating deposited far from the thermodynamic equilibrium approach the equilibrium state?
The image series shows the de-wetting of a 300 nm thick Cu film from a Carbon substrate at approx. 1000 K. The mechanism of de-wetting is first recrystallization, then hole formation at the convergence point of different grain boundaries and, finally, complete decomposition into isolated droplets. The image on the right hand side shows a simulation of the droplet positions. The red lines emphasize characteristic droplet correlations.

De-wetting of a 300 nm thick Cu film from a Carbon substrate at approx. 1000 K

© IFP