TU Wien, June 4 - 7, 2023

Group photo HMM 2023

© Matthias Heisler

Group photo HMM 2023

© Matthias Heisler

Group photo HMM 2023

© Matthias Heisler

The biennial International Symposium on Hysteresis Modeling and Micromagnetics (HMM) is an interdisciplinary forum for discussion of the most recent advancements in the fields of hysteresis modeling and micromagnetics. It aims to bring together scientists with various backgrounds (e.g., mathematicians, physicists, engineers, and materials scientists) to exchange ideas and to present new approaches and results.

The 13th edition of HMM will take place from June 4 to June 7, 2023 in Vienna, Austria. Invited by the Major of Vienna, all participants in HMM 2023 can participate in a welcome reception (including joint dinner) at Vienna City Hall, opens an external URL in a new window in the evening of June 4, 2023. The scientific program of HMM 2023 will take place from June 5 to June 7, 2023 at TU Wien. Following the tradition of the symposium, the scientific program will consist of a single session with invited keynote lectures, contributed talks and posters (no parallel sessions). The working language of the conference is English. The local organizing committee and the scientific and program committee, in agreement with the HMM international steering committee, believe that an interdisciplinary forum like HMM should be held in person. Therefore, HMM 2023 is planned as a fully in-person event. The local organizing committee will constantly monitor the status of the COVID-19 pandemic and the associated government regulations in order to ensure a safe in-person meeting.

Acknowledgments

The support of

is thankfully acknowledged.

Logos of TU Wien, MMM, University of Vienna, University for Continuing Education Krems, Vienna PDE Center, FWF, SFB, City of Vienna and Meeting Destination Vienna

Topics

HMM 2023 will cover contributions related (but not restricted) to the following topics:

  • Mathematical modeling of hysteresis
  • Preisach, Jiles-Atherton and vector hysteresis modeling
  • Classical and quantum spin models, random-field models and frustrated magnetism
  • Novel developments in micromagnetics, link to other physical models
  • Magnetic excitations and solitons
  • Ab-initio, atomistic and multiscale modeling
  • Modeling of thermal effects in magnetism
  • Modeling of magnetization dynamics and spintronics
  • Modeling of individual magnetic nanostructures and their interactions
  • Modeling of magnetic systems for technological and biomedical applications
  • Mathematical and numerical analysis of partial differential equations with hysteresis
  • Mathematical and numerical analysis of partial differential equations in micromagnetics
  • Experimental studies and model validation

Local organizing committee

Important dates

  • January 16, 2023: Abstract submission opening
  • March 12, 2023: Abstract submission deadline
  • March 1, 2023: Registration opening
  • March 16, 2023: Notification of decision on abstracts
  • March 31, 2023: Registration deadline (early bird)
  • April 30, 2023: Registration deadline (standard)
  • June 4-7, 2023: HMM 2023

UPDATE (March 12, 2023): The submission of abstracts for contributed talks is now closed. Submission of abstracts for contributed posters is still possible (until March 26, 2023). Abstracts will be reviewed on a rolling basis and authors will be advised of acceptance/rejection of their abstracts shortly after submission. Please contact the organizers at hmm2023@asc.tuwien.ac.at if you have any question.

Conference poster

Be careful of scams!

We have been made aware of very convincing scams. HMM participants may be contacted by email/phone by companies to arrange accommodation for the symposium or to pay the registration fee via PayPal. Please note that TU Wien is the only institution organizing HMM 2023 and no company has been authorized to arrange anything related to HMM. In particular, the HMM organizers will never contact you requesting credit card details or PayPal payments. If you are contacted by such companies, please let the organizers know as soon as possible.