The influence of miniaturization on the thermo-mechanical properties and lifetime of materials and material interconnects in microelectronics is being investigated. The most relevant results on single phase materials (Al, Cu, Au) and solderjoints (Ag-Sn on Cu substrate) are shown and discussed. Due to the fact that
microjoints in electronic devices are critical failure sites, a new fast shear fatigue testing technique was introduced as an alternative to the classical thermal cycling test procedures. It is possible to obtain lifetime data from wire bonds used in powerelectronics and optimize the manufacturing process in short time. The
advantages and problems are presented. Furthermore, the characterization of microstructure of the interconnects has been started using REM and TEM methods. Modal and vibration analysis is used to study interconnect failures non destructively. The applicability of these methods for miniaturized interconnects (automotive electronics) is being discussed. Vortragende: Prof. Dr. Brigitte Weiss, Physik Nanostrukurierter Materialien, Fakultät für Physik, Universität Wien