Surface sensitive analysis

© E308-01

Nanoindentation system

Tip configurations

Berkovich - standard nanoindentation

Cube corner - scratch testing and fracture restistance

Evaluation according to Oliver & Pharr

Force range up to 400 mN

wafer curvature measuring system

© E308-01

Ultra thermal scan

wafer curvature measuring system

Thermal Scans up to 1000 °C

Annealing environments: Argon

UHV vacuum upgrade in development


© E308-01

Nanovea PS50 White-light interferometer

chromatic confocal measuring principle

Evaluation of biaxial stress state in thin film deposition

Testing parameters:

  • X-Y Scan Area: 50x50 mm
  • Scan Speed: 20 mm/s


© E308-01

Nanovea T50